1. Crystallography and Product Basics of Silicon Carbide
1.1 Polymorphism and Atomic Bonding in SiC
(Silicon Carbide Ceramic Plates)
Silicon carbide (SiC) is a covalent ceramic compound made up of silicon and carbon atoms in a 1:1 stoichiometric proportion, differentiated by its impressive polymorphism– over 250 recognized polytypes– all sharing strong directional covalent bonds yet varying in piling series of Si-C bilayers.
One of the most highly relevant polytypes are 3C-SiC (cubic zinc blende structure), and the hexagonal forms 4H-SiC and 6H-SiC, each displaying refined variants in bandgap, electron flexibility, and thermal conductivity that influence their viability for particular applications.
The toughness of the Si– C bond, with a bond power of roughly 318 kJ/mol, underpins SiC’s amazing hardness (Mohs hardness of 9– 9.5), high melting point (~ 2700 ° C), and resistance to chemical degradation and thermal shock.
In ceramic plates, the polytype is normally chosen based on the meant usage: 6H-SiC prevails in architectural applications because of its ease of synthesis, while 4H-SiC dominates in high-power electronic devices for its exceptional cost carrier mobility.
The vast bandgap (2.9– 3.3 eV depending upon polytype) additionally makes SiC an exceptional electrical insulator in its pure form, though it can be doped to work as a semiconductor in specialized electronic gadgets.
1.2 Microstructure and Phase Purity in Ceramic Plates
The performance of silicon carbide ceramic plates is critically dependent on microstructural features such as grain dimension, density, stage homogeneity, and the existence of additional stages or impurities.
Top quality plates are typically made from submicron or nanoscale SiC powders through advanced sintering methods, resulting in fine-grained, totally dense microstructures that maximize mechanical strength and thermal conductivity.
Contaminations such as complimentary carbon, silica (SiO TWO), or sintering aids like boron or aluminum need to be meticulously managed, as they can create intergranular movies that lower high-temperature stamina and oxidation resistance.
Residual porosity, also at low degrees (
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