Power chips are attached to outside circuits through product packaging, and their performance depends upon the support of the product packaging. In high-power scenarios, power chips are typically packaged as power components. Chip affiliation describes the electric connection on the upper surface area of the chip, which is generally aluminum bonding cable in conventional components. ^
Traditional power module package cross-section
At present, commercial silicon carbide power components still mainly make use of the product packaging modern technology of this wire-bonded typical silicon IGBT component. They encounter issues such as huge high-frequency parasitical parameters, not enough warm dissipation capacity, low-temperature resistance, and insufficient insulation toughness, which limit using silicon carbide semiconductors. The display screen of exceptional performance. In order to fix these issues and totally manipulate the huge potential advantages of silicon carbide chips, lots of new packaging innovations and remedies for silicon carbide power components have actually arised in the last few years.
Silicon carbide power component bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have established from gold wire bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have created from gold cables to copper wires, and the driving pressure is price reduction; high-power gadgets have actually established from aluminum cables (strips) to Cu Clips, and the driving pressure is to improve product efficiency. The better the power, the higher the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that utilizes a solid copper bridge soldered to solder to link chips and pins. Compared with traditional bonding packaging methods, Cu Clip innovation has the complying with advantages:
1. The connection in between the chip and the pins is made from copper sheets, which, to a certain degree, replaces the standard cable bonding technique between the chip and the pins. As a result, a distinct plan resistance worth, higher current circulation, and better thermal conductivity can be gotten.
2. The lead pin welding area does not require to be silver-plated, which can totally save the expense of silver plating and poor silver plating.
3. The product appearance is totally constant with regular items and is primarily made use of in web servers, mobile computer systems, batteries/drives, graphics cards, motors, power supplies, and various other areas.
Cu Clip has 2 bonding approaches.
All copper sheet bonding method
Both the Gate pad and the Source pad are clip-based. This bonding technique is extra expensive and intricate, but it can achieve better Rdson and much better thermal results.
( copper strip)
Copper sheet plus cord bonding technique
The source pad utilizes a Clip technique, and eviction uses a Wire method. This bonding technique is a little less costly than the all-copper bonding technique, saving wafer area (applicable to extremely tiny entrance areas). The procedure is less complex than the all-copper bonding method and can get better Rdson and far better thermal result.
Vendor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding insulated copper wire, please feel free to contact us and send an inquiry.
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